3DIC TSV Process Control
3DIC manufacturing is facing enormous process control issues. SIC developed an innovative technology to meet the process control needs of TSV creation, copper reveal, and bump height measurement.
Film stress and and wafer bow measurements are an integral part in the process of reliability monitoring of deposited thin films during the chip making process.
Stress monitoring has become increasingly critical with the advent of 3D integrated circuits.
413 Series
Substrate Thickness, Warp, and TTV Measurement
with or without Tape
for Wafer Backgrind and Etch Thinning processes.
Non-contact Echoprobe Technology.
Thin film and surface roughness options.
413 C2C 413 SA 413 PR 413MOT
413 C2C 413 SA 413 PR 413MOT
