413 Series
Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.
413 PR
413PR is specially designed for automatic substrate thickness measurement on wafers with optically turbid (milky) tapes, as well as for applications demanding fast, reliable, automatic measurement site location. Special optics and illumiation allow rapid location of areas of interest. Semi-automatic system with enclosure for wafers up to 300mm with or without frame..
