413 Series

<p>Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.</p>

Models: 413 C2C | 413 SA | 413 PR | 413MOT |