Raman 360 and FSM127
Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.
Raman-360
Micro Raman system for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling. Fully automated C2C system.
